Universal memory module/PCB storage, transport, automation handling tray

ABSTRACT

An adjustable tray for a semiconductor device, and method of using the tray for handling the device, are provided. Each tray comprises a front frame segment and a back frame segment opposing the front frame segment, and a pair of opposing side frame segments secured to the front and back frame segments to form right angles, each side frame segment containing a longitudinal channel. Each tray further includes a fixed locator segment and an adjustable locator segment, each having a plurality of slots for receiving semiconductor devices therein. The distal ends of the locator segments are secured to the pair of opposing side frame segments at right angles. The adjustable locator segment can be manipulated such that the fixed and adjustable locator segments are spaced apart a distance commensurate with the width of the semiconductor device. The device is friction fit into a slot such that the device is only contacted at keep-out areas on the device. Using stand-offs mounted in stand-off receptacles, two or more trays can be modularly stacked.

FIELD OF THE INVENTION

[0001] This invention relates in general to handling semiconductorsubstrate trays and, more particularly, to a modularly stackable,adjustable tray for storing, transporting, and handling a semiconductorintegrated circuit device.

BACKGROUND OF THE INVENTION

[0002] Various techniques have been developed for the storing,transporting, and handling of semiconductor integrated circuit devices.Many semiconductor devices, such as printed circuit boards, areexpensive and delicate. Accordingly, they must be carefully handledafter processing for storage and shipment. Such boards can be fragileunder loads applied to the surface of the board that typically carriescomponents. Since such semiconductor devices are rather resistant to endloads or compression forces that act edgewise upon the board, theconcept of slotted devices for holding and transporting semiconductordevices has been conventionally used.

[0003] For example, U.S. Pat. No. 3,664,510 (Kerschbaum) shows a cardcage for printed circuit cards in which flexible plastic members aremounted in a metal frame to hold the printed cards in place in avertical orientation. Further, U.S. Pat. No. 3,458,767 (Hedger) shows arack that has opposed rows of parallel guides into which circuit boardscan be slid into place. These holders are typical of the type of devicesused to hold circuit boards. However, the holders are not adjustable toaccommodate varying substrate sizes.

[0004] One circuit board holder having adjustable compartments isdescribed in U.S. Pat. No. 4,158,876 (Pedro). However, Pedro requiresthat the circuit boards be secured by sliding opposing edges of theboard through opposing elongated recesses. Such extensive contact cancause damage to components on the board. Also, since the board merelyrests on a lower lip of the compartment when inserted, only the pull ofgravity on the board can keep the board secure. Furthermore, the holderin Pedro is not stackable.

[0005] Given these limitations of the prior art, there is a clear needfor an improved tray for storing, transporting, and handlingsemiconductor devices.

SUMMARY OF THE INVENTION

[0006] The present invention provides a universal memory module/printedcircuit board storage, transport, and automation handling tray. In oneaspect in particular, the invention comprises an adjustable tray forsemiconductor devices.

[0007] In one embodiment, the semiconductor device trays compriseopposing front and back frame segments, opposing side frame segmentscontaining a longitudinal channel, a fixed locator segment secured tothe tray, and an adjustable locator segment temporarily secured to thelongitudinal channel. In these embodiments, both the fixed locatorsegment and the adjustable locator segment comprise distal ends andslots for receiving the semiconductor devices. The distal ends have aguide element that is received by the longitudinal channels.

[0008] In one embodiment, a middle portion of the slots in the locatorsegments has a slot width that ensures the semiconductor device isfriction fit when placed into the slots. As the semiconductor devicesare received by the tray, contact between the devices and the slots isrestricted to keep-out areas. As such, components on the semiconductordevice do not contact the tray.

[0009] In another embodiment, the adjustable locator segment is movedwith respect to the fixed locator segment such that the distance betweenthe two segments corresponds to the width of the semiconductor device.In a further embodiment, the tray pitch present on the locator segmentsis greater than the aggregate thickness of the semiconductor device. Insuch embodiments, the tray pitch is the distance between adjacent slotson a locator segment, and the aggregate thickness is the thickness ofthe semiconductor device and any protruding components disposed on thedevice.

[0010] In yet another embodiment, the front, back, and opposing sideframe segments can include stand-off receptacles. The stand-offreceptacles are configured to receive and removably secure stand-offs sothat a second adjustable semiconductor tray can be mounted on the standoff of a first tray. Mounting in this fashion provides verticalseparation between the two (or more) adjustable semiconductor trays. Inanother embodiment, the opposing side frame segments provide thevertical separation. In these embodiments, the side frame segmentsextend upwardly from a first tray and are received by a second traymounted on the first. The side frame segments are taller than the heightof the device.

[0011] In one embodiment, the fixed locator segment is secured to thefront frame segment and/or the opposing side frame segments. In anotherembodiment, the guide element can be a salient, a tongue, a detent, adove-tail, a gear, a roller, a pulley, a flange, and/or a ball. In suchembodiments, the longitudinal channels can contain a mating guideelement that is a gear, a chain, a belt, ball bearings, and/or alubricant.

[0012] In a further embodiment, the tray comprises a locking mechanismfor temporarily securing the adjustable locator segment. In still otherembodiments, the front, back, opposing side, fixed locator, andadjustable locator segments comprise one or more static dissipatingmaterials such as Semitron ESD 225, a trademark for a static dissipativeacetal.

[0013] In another embodiment of the present invention, the trayscomprise opposing front and back frame segments, opposing side framesegments containing a longitudinal channel, a fixed locator segmentsecured to the tray, and an adjustable locator segment temporarilysecured to the longitudinal channel. In these embodiments, both thefixed locator segment and the adjustable locator segment comprise distalends and slots for receiving semiconductor devices therein. The distalends have a guide element that is received by the longitudinal channels.When the slots receive the semiconductor devices, the devices aretemporarily secured by a friction fit, and contact between a device anda slot is restricted to the keep-out areas. The keep-out areas cancomprise a portion of one or more lower peripheral regions of asemiconductor device that is devoid of electrical components.

[0014] In another embodiment, the slots of the fixed locator segmentand/or the adjustable locator segment can comprise slot walls with anupper portion that is tapered, rounded, or otherwise configured toassist in guiding a semiconductor device into the slot. In furtherembodiments, an adjustable locator segment is moveable, with respect tothe fixed locator segment, to correspond to the width of thesemiconductor device. In still further embodiments, when received andsecured in a tray, the semiconductor devices are transverse to the tray.

[0015] In still another embodiment, the tray comprises opposing frontand back frame segments and opposing adjustable locator segments. Insuch embodiments, each side frame segment contains a longitudinalchannel and is secured to the front frame segment and/or the back framesegment. Further, the opposing adjustable locator segments comprisedistal ends and slots for receiving semiconductor devices. In theseembodiments, the distal ends have a guide element that is received by,and temporarily secured within, the longitudinal channel.

[0016] In yet another embodiment, the opposing adjustable locatorsegments are adjustable such that the distance between the opposinglocator segments corresponds to the width of a semiconductor device.

[0017] Another aspect of the present invention provides a modular traysystem. In one embodiment, the system comprises semiconductor deviceshaving electrical components disposed thereon and at least two trays forreceiving the devices therein. In such embodiments, the semiconductordevice trays comprise opposing front and back frame segments, opposingside frame segments containing a longitudinal channel, a fixed locatorsegment secured to the tray, and an adjustable locator segmenttemporarily secured to the longitudinal channel. In these embodiments,both the fixed locator segment and the adjustable locator segmentcomprise distal ends and slots for receiving the semiconductor devicestherein. The distal ends have a guide element that is received by thelongitudinal channels. In these aspects of the system, the two (or more)adjustable semiconductor device trays are modularly stacked upon oneanother.

[0018] In another embodiment, the system comprises a locking mechanismfor temporarily securing the two (or more) modularly stacked trays.

[0019] Another aspect of the present invention involves a method ofhandling one or more semiconductor devices. In one embodiment, themethod comprises providing semiconductor devices having electricalcomponents disposed thereon, providing a tray, and manipulating anadjustable locator segment in the tray such that a fixed locator segmentand the adjustable locator segment are spaced apart a distancecommensurate with the thickness of the semiconductor devices. Then, thesemiconductor devices are inserted into the tray with a friction fit.Thereafter, one or more additional trays can be provided and modularlystacked after having received semiconductor devices. In a furtherembodiment, the adjustable locator segment is manipulated (or moved) bya person. In still further embodiments, the manipulating, inserting, andsecuring acts can at least partially be performed in an automated,computer controlled process.

[0020] In another embodiment, method comprises processing semiconductordevices using an adjustable tray. In one embodiment, the methodcomprises determining the thickness, the aggregate thickness, and thewidth of a semiconductor device and selecting two locator segments basedon these determined measurements. In these embodiments, each of theslots disposed within the fixed and/or adjustable locator segments has aslot width smaller than the thickness of the semiconductor device.Further, adjacent slots disposed within the fixed and/or adjustablelocator segments have a tray pitch larger than the aggregate thicknessof the semiconductor device. Thereafter, the two locator segments areinserted into a frame assembly by aligning guide elements on the locatorsegments with opposing channels in side frame segments in the frameassembly. The guide elements are then urged forward into the opposingchannels of the side frame segments. The back frame member of the trayis then secured to the frame assembly. The two locator segments areadjusted such that the distance between the two locator segmentscorresponds with the width of semiconductor devices. The semiconductordevices are then secured in the slots by inserting keep-out areas of thesemiconductor devices into the slots to create a friction fit.

[0021] In another embodiment, the method further comprises insertingstand-offs into stand-off receptacles that are disposed on the frameassembly such that one or more adjustable semiconductor trays can bemodularly stacked. In another embodiment, each slot in the fixed and/oradjustable locator segment comprises opposing slot walls that produce afiction fit when the semiconductor device is inserted between the wallsof the slot.

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Embodiments of the invention are described below with referenceto the following accompanying drawings, which are for illustrativepurposes only. The invention is not limited in its application to thedetails of construction or the arrangement of the components set forthin the following description or illustrated in the drawings. Theinvention is capable of other embodiments or of being practiced orcarried out in other various ways. Also, it is to be understood that theterminology and phraseology employed herein is for purpose ofdescription and illustration and should not be regarded as limiting.Like reference numerals are used to indicate like components.

[0023]FIG. 1 is a perspective view of an embodiment of an adjustable,modularly stackable tray with a semiconductor device secured thereinaccording to the invention.

[0024]FIG. 2 is a perspective view (partially exploded) of the frameassembly and stand-offs of the tray of FIG. 1.

[0025]FIG. 3 is a perspective view of the longitudinal channel in eachside frame segment in the frame assembly of FIG. 2.

[0026]FIG. 4 is a perspective view of a locator segment in the tray ofFIG. 1 illustrating a plurality of slots.

[0027]FIG. 5 is a perspective view of a slot disposed within the locatorsegment of FIG. 4.

[0028]FIG. 6 is a front, elevational view of the slot of FIG. 5illustrating the slot thickness and longitudinal axis.

[0029]FIG. 7 is a top, plan view of a portion of the locator segment ofFIG. 4 illustrating the tray pitch.

[0030]FIG. 8 is a perspective view of an end of the locator segment ofFIG. 4.

[0031]FIG. 9 is a top, plan view (partially exploded) of the frameassembly of FIG. 2 illustrating locator segments (FIG. 4) within theframe assembly.

[0032]FIG. 10 is a front, elevational view of an embodiment of asemiconductor device for insertion into the tray of FIG. 1.

[0033]FIG. 11 is a side, elevational view of the semiconductor device ofFIG. 10.

[0034]FIG. 12 is a cut-away portion of the semiconductor device of FIG.10, highlighting the keep-out area on the semiconductor device.

[0035]FIG. 13 is a perspective view (exploded) of an additionaladjustable, modularly stackable tray being stacked upon the tray of FIG.1.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0036] The invention will be described generally with reference to thedrawings for the purpose of illustrating the present preferredembodiments only and not for purposes of limiting the same.

[0037] In the current application, the terms “semiconductive waferfragment” or “wafer fragment” or “wafer” will be understood to mean anyconstruction comprising semiconductor material, including but notlimited to bulk semiconductive materials such as a semiconductor wafer(either alone or in assemblies comprising other materials thereon), andsemiconductive material layers (either alone or in assemblies comprisingother materials). The term “substrate” refers to any supportingstructure including, but not limited to, the semiconductive waferfragments or wafers described above. As used herein, the terms “front”,“back”, “top”, and “bottom” are used for illustrative purposes only andare not meant to limit the description of the invention in any way.

[0038] In the illustrated example, a semiconductor device known as aprinted circuit board (PCB) will be used to describe the invention,although other conventional semiconductor devices known in themicroelectronics or semiconductor industry can be used in connectionwith the described tray.

[0039] Referring to FIG. 1, an embodiment of an adjustable, modularlystackable tray 2 according to the invention is illustrated. The tray 2,comprising a frame 4 constructed of frame segments 6, 8, 10, is shownsecuring a semiconductor device 12 within the slots 14 of locatorsegments 16, 18. The semiconductor device 12, bearing several attachedelectrical components 20, is vertically oriented with respect to thehorizontally oriented tray 2. Also, FIG. 1 illustrates a plurality ofstand-offs 22 located proximate corners 24 of the tray 2.

[0040] Frame 4, employed by tray 2 in FIG. 1, is depicted partiallyassembled and in more detail in FIG. 2. As FIG. 2 shows, frame 4comprises a first (front) frame segment 6, a second (back) frame segment8, and a pair of opposing side frame segments 10. Each of these foursegments 6, 8, 10 will be secured together to erect frame 4. As shown,an end 28 of one side frame segment 10 is secured to front frame segment6 proximate a first end 26 of front frame segment. Similarly, an end 28of opposing side frame segment 10 is secured to front frame segment 6proximate a second end 30 of the front frame segment. Thus, three of thesegments 6, 10 of frame 4 are secured together.

[0041] Back frame segment 8 is illustrated prior to being secured to theremaining segments 6, 10. Back frame segment 8, like front frame segment6, will eventually be secured to the ends 28 of opposing side segments10 to complete frame 4. An end 28 of one side frame segment 10 will besecured to back frame segment 8 proximate a first end 32 of the backframe segment. Likewise, another end 28 of an opposing side framesegment 10 will be secured to back frame segment 8 proximate a secondend 34 of the back frame segment. As such, when frame 4 is assembled,front and back frame segments 6, 8 oppose each other. The four joinedsegments 6, 8, 10 form right angles when positioned in a common,horizontal plane. Typically, when perceived from a top plan view such asshown in FIG. 9, the combination of segments 6, 8, 10 takes the shape ofa square or rectangle. Each of the segments 6, 8, 10 can be constructedby a machining or molding technique, such as vacuum molding, and aretypically made from a static dissipating material such as Semitron ESD225, ABS plastic (carbon impregnated), and the like.

[0042] Each side frame segment 10 contains a longitudinal channel 36therein as illustrated in FIG. 3. The longitudinal channel 36 typicallyextends within the entire length of a side frame segment 10, althoughthe channel can be limited to a portion of the length. However, at leastone end 28 of a side frame segment 10 provides an end channel opening38. The end 28 with the end channel opening 38 is preferably disposedtowards back frame segment 8. Referring back to FIG. 2, when frame 4 oftray 2 is assembled, the channel 36 found within each side frame segment10 faces inwardly. Thus, the channels 36 on opposing side frame segments10 face and oppose each other.

[0043] One of the two similar locator segments 16, 18 of FIG. 1 isdepicted in detail in FIG. 4. Like frame segments 6, 8, 10, locatorsegments 16, 18 can be constructed by a machining or molding techniqueand are typically made from a static dissipating material such asSemitron ESD 225. Locator segments 16, 18 each comprise an elongatemember, containing a plurality of slots 14 therein, having a guideelement 40 proximate each end 42. As FIG. 4 illustrates, slots 14 withinlocator segments 16, 18 are arranged substantially along the entirelength of the locator segments. Furthermore, the slots 14 open toward atop surface 44 and are disposed toward a front surface 46 of the locatorsegments 16, 18 such that each slot 14 comprises a top surface opening48 and a front surface opening 50. The slots 14 are shown in greaterdetail in FIGS. 5-7.

[0044] As illustrated in FIG. 5, slots 14 have a top surface opening 48on the top surface 44 of locator segments 16, 18 and extend downwardlytoward the bottom surface 52 of the locator segments. Typically, slots14 do not penetrate bottom surface 52 of locator segments 16, 18.

[0045] Likewise, slots 14 have a front surface opening 50 on the frontsurface 46 of locator segments 16, 18 and extend inwardly toward backsurface 54 of the locator segments. Again, typically slots 14 do notpenetrate back surface 54 of the locator segments 16, 18. In oneembodiment, as illustrated in FIGS. 5 and 6, an upper portion 56 of slot14 has slot walls 58 that are tapered from the top surface 44 towardsthe bottom surface 52 until the slot walls reach a middle portion 60 ofthe slot. In other embodiments, the slot walls 58 at the upper portioncan be rounded, concave, convex, funnel-shaped, conical or the like toguide the device 12 into slot 14. At middle portion 60, opposing slotwalls 58 become vertically oriented and again extend towards the bottomsurface 52 until reaching a lower portion 62 of slot 14. At the middleportion 60 of slot 14, as illustrated in FIG. 6, the distance betweenopposing slot walls 58 defines a slot width 64. Lower portion 62 of slot14 can be expanded and become hemispherical or similarly shaped.

[0046] As further illustrated in FIG. 6, each slot 14 has a longitudinalaxis 66. The distance between the longitudinal axis 66 of adjacent slots14, 14 a, defines a tray pitch 68 as illustrated in FIG. 7. In oneembodiment, the tray pitch 68 between adjacent slots 14, 14 a on thelocator segments 16, 18 is kept constant over the entire length of thelocator segment. However, tray pitch 68 can be varied over the length ofthe locator segments 16, 18, as desired.

[0047] Referring to FIG. 8, the locator segments 16, 18 further comprisea guide element 70 proximate each end 42 of the locator segments. Guideelement 70 typically comprises a protruding portion of, or addition to,end 42 of locator segments 16, 18. In the embodiment shown in FIG. 8,guide element 70 is illustrated as a protruding salient. The protrudingsalient guide element 70 is configured to correspond to, and fit within,channels 36 of side frame segments 10. As such, frame 4 can receive oneor more locator segments 16, 18 within channels 36 when guide elements70 on ends of the locator segments are aligned with the channels in theside frame segments 10. In other embodiments, the guide element 70 cancomprise, for example, a detent, a tongue, a dove-tail, a gear, aroller, a pulley, a flange, or a ball. In such embodiments, channel 36will generally contain therein, for example, a gear, a chain, a belt,ball bearings, a lubricant, or other mating guide element (not shown) tocomplimentarily and correspondingly receive the particular selectedguide element 70.

[0048]FIG. 9 illustrates two locator segments 16, 18 as received bypartially assembled frame 4. Guide element 70 on each end 42 of locatorsegments 16, 18 is aligned with, and inserted into, channel 36 of eachopposing side frame segment 10. The locator segments 16, 18 are thenslid along channels 36 and into position inside frame 4. In oneembodiment, one locator segment 16 is fixed while the other locatorsegment 18 is adjustable. As shown in FIG. 1, back surface 54 of fixedlocator segment 16 can be secured to front frame segment 6. In otherembodiments, the ends 42 of the fixed locator segment 16 can be securedto opposing side frame segments 10 at or near front frame segment 6 asillustrated in FIG. 9.

[0049] Adjustable frame locator segment 18 can be moved, via guideelements 70 within channels 36, toward or away from fixed locatorsegment 16 as shown by directional arrows 98, 100. As such, the distancebetween locator segments 16, 18 can be increased or decreased asdesired. A locking mechanism (not shown) such as a set screw, aspring-loaded pin, and the like, attached to opposing side framesegments 10 can be employed to temporarily secure the adjustable locatorsegment 18 in a particular location once a desired position is achieved.

[0050] In another embodiment, both locator segments 16, 18 areadjustable. Such an arrangement provides an increased ability to situatelocator segments 16, 18 within the tray and relative to one another.Also, by using two adjustable locator segments 16, 18, semiconductordevices 12 secured therein can be centered within tray 2 to bolster thestability of the tray.

[0051] An embodiment of a semiconductor device 12 with attachedcomponents 20 is illustrated in greater detail in FIG. 10. As shown,device 12 has a known and measurable width 72 and height 74. Also, FIG.11 illustrates the semiconductor device 12 in profile where the devicehas a known and measurable thickness 76. Furthermore, the device 12 hasan aggregate (total) thickness 78 defined by the thickness of the device12 including the electrical components 20 disposed thereon. Electricalcomponents 20 can protrude from a semiconductor device surface 80.Therefore, the thickness of the components on the surface of the deviceis accounted for in determining aggregate thickness 78.

[0052] Referring to FIG. 12, semiconductor device 12 further compriseskeep-out areas 82. Keep-out areas 82, which are highlighted in FIG. 12by diagonal hatching, typically occur proximate the lower, peripheralregions 84 of device 12. The keep-out areas 82 are so named because thekeep-out areas are devoid of any electrical components 20 or otherfragile semiconductor elements (not shown) that can be easily damagedduring the handling of the device. Thus, if physical contact with device12 is required, it is preferred that the contact be limited to keep-outareas 82 to ensure the integrity of the device and any devicecomponents.

[0053] Referring back to FIGS. 1 and 2, a plurality of stand-offs 22 areillustrated. Each stand-off 22 comprises an elongate member having acentral portion 86, with a larger diameter, and distal end portions 88,with smaller diameters, thereby creating circumferential shoulders 90.Although a cylindrical stand-off 22 is illustrated, the stand-offs cantake a variety of different shapes. Central portion 86 can be comprisedof a variety of lengths, however, the central portion is preferablygreater than the height 74 of the semiconductor device 12 to facilitatemodular stacking while avoiding damage to the device. Within both thetop 92 and the bottom 94 of each side frame segment 10, a plurality ofstand-off receptacles 96 are illustrated. The stand-off receptacles 96can be generally located near ends 28 of the opposing side framesegments. Each of the stand-off receptacles 96 is configured to receivea stand-off 22, the stand-off being received by the stand-off receptacleuntil penetration is halted by the circumferential shoulder 90. Byutilizing a plurality of stand-offs 22 in combination with stand-offreceptacles 96, one or more trays 2 can be modularly stacked.

[0054] In another embodiment, a pair of upwardly, and verticallyextending, opposing side frame segments (not shown) can be utilizedinstead of stand-offs 22 and stand-off receptacles 96. The height ofside frame segments in these embodiments is preferably greater than thedevice height 74 to facilitate modular stacking while avoiding damage tothe device. In such embodiments, bottom 94 of side frame segments 10would receive a portion of top 92 of side frame segments from anadditional tray. In another embodiment, each of the front, back, andopposing side frame segments 6, 8, 10 can contain therein a plurality ofstand-off receptacles 96 (not shown).

[0055] With the components of the tray outlined, an embodiment of amethod of using the tray according to the invention can be articulated.The semiconductor device 12 to be stored, handled, transported, orotherwise processed is selected. Thereafter, the thickness 76 of device12 is determined. The aggregate thickness 78 of device 12 and anycomponents 20 is then determined. Next, appropriate locator segments 16,18 are selected based on thickness 76 and aggregate thickness 78. As anexample, an appropriate locator segment is one where slot width 64 isslightly smaller than device thickness 76 and tray pitch 68 is slightlylarger than aggregate thickness 78.

[0056] After locator segments 16, 18 are selected, the segments areintroduced into the partially assembled frame 4 as depicted in FIG. 9.Guide elements 70 on each end of locator segments 16, 18 are alignedwith channels 36 in opposing side frame segments 10. Upon alignment,guide elements 70 are inserted into the channels 36. Thereafter, backframe segment 8 is secured to remaining frame segments 6, 10 to formframe 4 of tray 2.

[0057] The semiconductor device 12 is examined and device width 72 isascertained. Generally, as shown in FIG. 10, the device width 72 ismeasured from one lower peripheral region 84 to another. Notably, thekeep-out areas 82 are located within these lower peripheral regions 84to ensure that no components 20 or other fragile parts are near wheredevice 12 and tray 2 contact each other. After device width 72 isdetermined, one (or more locator segments 16, 18 are adjusted as neededto correspond to the width. Preferably, the one or more locator segments16, 18 are manipulated until the distance between the locator segmentsis substantially equal to device width 72. After an appropriate distancehas been established, one or more of locator segments 16, 18 are securedin that position.

[0058] With locator segments 16, 18 positioned and secured, tray 2 isready to accept the insertion of semiconductor device 12. To commenceinsertion, the keep-out areas 82 found in the lower peripheral regions84 of a vertically oriented device 12 are aligned with a correspondingpair of slots 14 on opposing locator segments 16, 18 in a horizontallyoriented tray 2. With the distance between locator segments 16, 18having been determined with respect to width 72, alignment can be easilyaccomplished. Keep-out areas 82 are guided into slots 14 at top surfaceslot openings 48 while tapered upper portions 56 of the slots assist insliding and positioning, or funneling, device 12 toward the middleportion 60 of the slots. As keep-out areas 82 pass into middle portion60 of slots 14, a friction fit of device 12 in slot 14 is accomplished.This result transpires because each slot width 64 is slightly smallerthan the device thickness 76. Device 12 continues to be urged into eachslot 14 until the device completely extends through lower portion 62 ofeach slot. Thus, only keep-out areas 82 of device 12 are contacted as afriction fit is accomplished and the device is secured in tray 2.

[0059] As one or more devices 12 are secured in a tray 4, it may becomedesirable to enlist additional trays 4 a as illustrated in FIG. 13. Forexample, where a dimension 72, 74, 76, 78 of device 12 changes, or wheretray 4 is filled with semiconductor devices, the use of additional trays4 a may become desirable. However, dealing with these extra trays 4 acan make transportation, storage, or handling cumbersome if the traysare not sufficiently managed. Preferably, trays 4, 4 a can be modularlystacked. To stack trays 4, 4 a, a plurality of stand-offs 22 areinserted into stand-offs receptacles 96 located on top 92 of an opposingside frame segment 10 in tray 4. Center portion 86 of stand-off 22preferably exceeds height 74 of device 12 so that damage to the devicedoes not occur upon stacking. When completely inserted, shoulders 90 ofstand-offs 22 will be in contact with top 92. Thereafter, the stand-offreceptacles 96 a on the bottom 94 a of an additional tray 4 a arealigned with stand-offs 22 extending upwardly from the first tray 4. Theadditional tray 4 a is then lowered such that the stand-offs 22 on thefirst tray 4 are received by stand-off receptacles 96 a on theadditional tray 4 a. When completely inserted, shoulders 90 ofstand-offs 22 will be in contact with the bottom 94 a of additional tray4 a. As this process is repeated, multiple additional trays can bemodularly stacked.

[0060] Despite the above step being outlined in a step-by-step sequence,the completion of the acts in a particular chronological order is notmandatory. Several of the acts can be undertaken and accomplished atdifferent times to achieve a tray according to the invention.

[0061] In compliance with applicable statutes, the invention has beendescribed in language more or less specific as to structural andmethodical features. It is to be understood, however, that the inventionis not limited to the specific features shown and described, since themeans herein disclosed comprise preferred forms of putting the inventioninto effect. The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

What is claimed is:
 1. An adjustable tray for a semiconductor devicecomprising: opposing front and back frame segments; opposing side framesegments, each side frame segment containing a longitudinal channeltherein and being secured to the front frame segment and the back framesegment to form right angles in a horizontal plane; a fixed locatorsegment secured to the tray; and an adjustable locator segment removablysecured within the longitudinal channel of each opposing side framesegment; wherein both the fixed locator segment and the adjustablelocator segment comprise distal ends and a plurality of slots forreceiving the semiconductor device therein, the distal ends having aguide element received by the longitudinal channels of each side framesegment.
 2. The tray of claim 1, wherein at least a middle portion ofthe slots has a slot width such that the semiconductor device isfriction fit into the slots.
 3. The tray of claim 1, wherein contactbetween the semiconductor device and the slots is restricted to one ormore keep-out areas on the semiconductor device.
 4. The tray of claim 1wherein the semiconductor device is received by the slots such thatcomponents on the semiconductor device do not contact the tray.
 5. Thetray of claim 1, wherein the adjustable locator segment is moved withrespect to the fixed locator segment such that a distance between theadjustable locator segment and the fixed locator segment corresponds toa width of the semiconductor device.
 6. The tray of claim 5, wherein atray pitch is greater than the aggregate thickness of the semiconductordevice.
 7. The tray of claim 1, wherein one or more of the front, back,and opposing side frame segments contain a plurality of stand-offreceptacles.
 8. The tray of claim 7, wherein each of the stand-offreceptacles is configured to receive and removably secure a stand-off,and with a second tray mounted on the stand off, the stand-off providesvertical separation between the two trays.
 9. The tray of claim 1,wherein the opposing side frame segments extend a height greater than aheight of the semiconductor device received in the tray, and theopposing side frame segments contain receptacles for receiving theupwardly and vertically extended side frame segments such that a secondtray can be modularly stacked.
 10. The tray of claim 1, wherein thefixed locator segment is secured to at least one of the front framesegment and the opposing side frame segments.
 11. The tray of claim 1,wherein the guide elements are selected from the group consisting of asalient, a tongue, a detent, a dove-tail, a gear, a roller, a pulley, aflange, and a ball.
 12. The tray of claim 11, wherein the longitudinalchannels contain therein a mating guide element selected from the groupconsisting of a gear, a chain, a belt, ball bearings, and a lubricant.13. The tray of claim 1, further comprising a locking mechanism fortemporarily securing the adjustable locator segment.
 14. The tray ofclaim 1, wherein one or more of the front frame segment, back framesegment, opposing side frame segments, fixed locator segment, andadjustable locator segment comprise a static dissipating material. 15.An adjustable tray for a semiconductor device comprising: opposing frontand back frame segments; opposing side frame segments, each side framesegment containing a longitudinal channel therein and being secured tothe front frame segment and the back frame segment to form right anglesin a horizontal plane; a fixed locator segment secured to the tray; andan adjustable locator segment temporarily secured within thelongitudinal channel of each opposing side frame segment; wherein boththe fixed locator segment and the adjustable locator segment comprisedistal ends and a plurality of slots for receiving the one or moresemiconductor devices therein, the distal ends having a guide elementreceived by the longitudinal channels of each opposing side framesegment, and the one or more semiconductor devices received by theplurality of slots are removably secured by a friction fit and contactbetween the one or more semiconductor devices and the slots isrestricted to one or more keep-out areas.
 16. The tray of claim 15,wherein the keep-out areas comprise a portion of at least one lowerperipheral region of the one or more semiconductor devices that isdevoid of components.
 17. The tray of claim 15, wherein the keep-outareas comprise a portion of two or more corners of the one or moresemiconductor devices that are devoid of components.
 18. The tray ofclaim 15, wherein slot walls at an upper portion of each slot in theplurality of slots are configured to assist in guiding the semiconductordevice into each slot in the plurality of slots.
 19. The tray of claim15, wherein the adjustable locator segment is moveable, with respect tothe fixed locator segment, to correspond to a width of the one or moresemiconductor devices.
 20. The tray of claim 15, wherein the one or moresemiconductor devices, when secured in the adjustable semiconductordevice tray, is transverse to the tray.
 21. An adjustable tray for asemiconductor device comprising: opposing front and back frame segments;opposing side frame segments, each side frame segment containing alongitudinal channel therein and being secured to the front framesegment and the back frame segment to form right angles in a horizontalplane; and opposing adjustable locator segments comprising distal endsand a plurality of slots for receiving the one or more semiconductordevices, the distal ends having a guide element, the guide element beingreceived by, and temporarily secured within, the longitudinal channel.22. The tray of claim 21, wherein one or more of the opposing adjustablelocator segments is adjusted such that a distance between the opposinglocator segments corresponds to a width of the one or more semiconductordevices.
 23. A modular tray system for a semiconductor devicecomprising: one or more semiconductor devices having components disposedthereon; at least two trays for receiving the one or more semiconductordevices; wherein the at least two trays each comprise opposing front andback frame segments and opposing side frame segments, each side framesegment comprising a longitudinal channel therein, a fixed locatorsegment secured to one of the at least two trays and an adjustablelocator segment removably secured to the longitudinal channel, both thefixed locator segment and the adjustable locator segment comprisingdistal ends and a plurality of slots for receiving the one or moresemiconductor devices, the distal ends having a guide element receivedby the longitudinal channels, and at least one of the at least two traysis modularly stacked upon another of the at least two trays.
 24. Thesystem of claim 23, further comprising a locking mechanism fortemporarily securing at least one of the trays to another tray whenmodularly stacked.
 25. A method of handling a semiconductor devicescomprising the steps of: providing the semiconductor device comprisingelectrical components disposed thereon; providing a tray comprisingopposing front and back frame segments, opposing side frame segments,each side frame segment containing a longitudinal channel therein andbeing secured to the front frame segment and the back frame segment toform right angles in a horizontal plane, the fixed locator segmentsecured within the tray, and the adjustable locator segment removablysecured within the longitudinal channel, wherein both the fixed locatorsegment and the adjustable locator segment comprise distal ends and aplurality of slots for receiving the device therein, the distal endshaving a guide element received by the longitudinal channels;manipulating an adjustable locator segment in the tray such that thefixed locator segment and the adjustable locator segment are spacedapart a distance commensurate with a thickness of the one or moresemiconductor device; inserting the semiconductor device into the tray;and securing the semiconductor device within the tray with a frictionfit.
 26. The method of claim 25, further comprising providing one ormore additional trays, and modularly stacking the one or more additionaltrays upon the tray after the tray has received the semiconductordevices.
 27. The method of claim 25, wherein a plurality ofsemiconductor devices are secured in the tray.
 28. The method of claim25, wherein the step of manipulating the adjustable locator segment isperformed by a person.
 29. The method of claim 25, wherein the steps ofmanipulating, inserting, and securing are at least partially performedin an automated, computer controlled process.
 30. A method of processinga semiconductor device using an adjustable tray, the method comprisingthe steps of: determining a thickness, an aggregate thickness, and awidth of the semiconductor device; selecting two locator segments eachhaving a plurality of slots therein, each slot having a slot widthsmaller than the thickness of the semiconductor device, and adjacentslots having a tray pitch larger than the aggregate thickness of thesemiconductor device; inserting the two locator segments into a frameassembly by aligning guide elements on the locator segments withopposing channels in side frame segments of the frame assembly, urgingthe guide elements forward into the opposing channels, and securing aback frame element to the frame assembly; adjusting at least one of thetwo locator segments such that a distance between the two locatorsegments corresponds with the width of the semiconductor device;securing the semiconductor device in the slots within the two locatorsegments by inserting a keep-out area of the semiconductor device intothe slots to create a friction fit.
 31. The method of claim 30, furthercomprising inserting a plurality of stand-offs into stand-offreceptacles disposed on the frame assembly and modularly stacking asecond tray on the stand offs.
 32. The method of claim 30, wherein eachslot of the locator segments comprises opposing slot walls, the slotwalls producing the fiction fit when the semiconductor device isinserted into the slot.